Huawei is accelerating its AI semiconductor roadmap with two new chips planned for 2027, as the Chinese technology major expands its domestic AI computing ecosystem and seeks to compete with Nvidia. The company announced the plans at Huawei Connect 2026 in Shanghai.
Huawei rotating chairman David Wang said, “ The company will launch the 960DT in the first quarter of 2027, followed by the Ascend 960PR in the third quarter. The two processors will form part of Huawei’s next generation of AI computing hardware.”
The announcement comes as demand for AI accelerators continues to rise. Huawei is developing its Ascend portfolio as an alternative to Nvidia’s AI computing hardware, particularly within China, where access to some advanced foreign chips remains restricted by US export controls.
Huawei also shipped more than 1,000 smaller AI systems, called supernodes, to over 370 customers, according to Wang. A supernode combines multiple AI chips to handle computing tasks as a coordinated system.
The company’s push reflects China’s wider effort to strengthen domestic AI infrastructure. US restrictions have limited Chinese companies’ access to some advanced computing processors and semiconductor manufacturing equipment, increasing the importance of locally developed hardware and networking technologies.
Huawei is also working to expand the software ecosystem around its processors. Wang further explained, “The company’s AI chip ecosystem currently has 5,270 monthly active developers.” This is an important metric as developers determine how easily AI hardware can be adopted for different workloads.
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